π The AI buildout's new bottleneck isn't GPUs, it's Taiwan's optical packaging lines
Industry Focus
π The AI buildout's new bottleneck isn't GPUs, it's Taiwan's optical packaging lines
TSMC says optical transceiver sales rose 25% in 2025 and silicon photonics should top 50% of the market by 2027, as Taiwan's packaging houses race to build the fiber and laser capacity that copper can no longer support inside AI data centers.