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🏭 The AI buildout's new bottleneck isn't GPUs, it's Taiwan's optical packaging lines

🏭 The AI buildout's new bottleneck isn't GPUs, it's Taiwan's optical packaging lines

TSMC says optical transceiver sales rose 25% in 2025 and silicon photonics should top 50% of the market by 2027, as Taiwan's packaging houses race to build the fiber and laser capacity that copper can no longer support inside AI data centers.

TSMC infographic comparing CPO-MCM vs CPO-OOI layouts and copper-to-OOI stages with energy-efficiency and latency callouts.
TSMC recast COUPE as an optical interposer at SEMICON Taiwan, shifting modulators and light sources to the backside as AI compute still outruns electrical I/O. Source

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